Anti-Vibration Fill - A Cost Effective Solution to Enhance Robustness

Chloe Ward
19/04/2018

In real-world industrial computing applications, more and smaller embedded devices are installed in harsh environments with constant shock or vibrations. The DRAM modules inside these devices may be vulnerable to these impacts, causing poor contact and connection.

Cervoz offer a value-added technology “Anti-Vibration Fill” to enhance the robustness of their DRAM modules to prevent the solder joints from coming loose. A third party Lab has verified the resistance against  the pull-out force and shear force will be double when the product has Anti-Vibration Fill.

Key applications include; in-vehicle computing, machine automation and military.

For more information, contact the team today.

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